Active cooling of hot Integrated Circuits Using a Rotating Cylinder and NEPCM-water Mixture: Numerical Analysis of the Impact of Phase Change and Magnetohydrodynamics on Double-Diffusive Mixed Convection

Efficient Cooling Of Integrated Circuits Is Crucial For Maintaining Optimal Performance and Longevity of Electronic Devices. This Study Addresses this Challenge by Investigating the Double-Diffusive Mixed Convection Around A Hot Integrated Circuit (Using) A Nano-Encapsulated Phase Change Material-Water Mixture for Enhanced Heat Absorption. The Cooling Process is Carried Out By A Cylinder Rotating At A Constant Speed Inside A Square Cavity Surrounded by the NEPCM-Water Mixture. Using The Galerkin Finite Element Method, We Numerically Analyzed The Influence Of Various Parameters, Including the Reynolds Number (10≤Re≤100), Richardson Number (0.1≤Ri≤10), Hartmann Number (0≤Ha≤80), NEPCM Volume Fraction (0.01≤Φ≤0.035), Lewis Number (0.1≤Le≤10), Buoyancy Ratio (1≤Nz≤5), Fusion Temperature (ϴ0.1≤ϴf≤0.9), And Stefan Number (0.1≤Ste≤0.8), On The Average Nusselt Number (Nuav), Average Sherwood Number (Shav), Total Entropy Generation (Stotal), And Bejan Number (Be). The Results Demonstrate That Increasing Re And Ri Enhances Nuav And Shav By Up To 175 % And 162 %, Respectively, While Applying A Magnetic Field (Increasing Ha) Suppresses Heat And Mass Transfer Rates By Up To 58 % And 50 %, Respectively. Increasing Φ Improves Nuav By Up To 34 % With Minimal Impact On Shav. The Le and Nz Govern the Coupling Between Heat and Mass Transfer Processes, With Le Substantially Influencing Shav And Nz Affecting Both Nuav and Shav. The ϴϴf Exhibits A Non-Monotonic Effect On Nuav, Suggesting An Optimal Fusion Temperature, While Ste Shows an Inverse Relationship With Nuav. The Stotal Is Significantly Influenced By Re, Ri, Ha, And Φ, While Be Is Affected by Re, Ri, Ha, And Φ To A Lesser Extent. These Findings Provide Valuable Insights Into The Complex Interplay Of Forced And Natural Convection, Magnetohydrodynamics, And Nepcms In The Active Cooling of Hot Electrical Elements. The Results Can be Applied to Optimize Cooling System Designs, Potentially Leading to More Efficient and Effective Thermal Management In Electronic Devices.